Job Responsibilities:
§ Support new product qualification;
§ New material and equipment qualification;
§ New process setup and qualification;
§ Establish process operating specifications/procedures, engineering change notice, etc.
§ Generate DOEs plan and perform experiments accordingly;
§ Technical reports writing(DOE, new material or product qualification);
§ Perform any other duties as assigned by supervisor.
Job Requirements:
§ Junior or Bachelor Degree or above in Electrical/Mechanical/Material Science Engineering;
§ About 3 years or more working experience in semiconductor IC assembly Lid attach, Underfill;
§ Good problem solving skill;
§ Good written / spoken English and reading comprehension;
§ Process working experience is preferred.
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If you're interested in this position, please submit your request to sccrecruitment@Statschippac.com