Under fill Technician/技术员3～4千

Job Responsibilities:

1. Provide first – Support to lines of highly automated equipment in high volume production environment.
2. Analyze, repair and trouble – shoot machine failures so that machines can operate according to specifications.
3. Perform periodic calibration, preventive maintenance of equipment in accordance to equipment maintenance schedules/specifications.
4. Maintain a good control of spare parts usage.
5. Help equipment engineer to track the performance of equipment and take necessary actions to improve the performance when needed.
6. Participate company wide various continuous improvement teams for enhancing operational excellence.
7. Train other new hire technicians to improve work skills
8. Perform any other duties assigned by the supervisor.
9. Support equipment engineer to finish new equipment, installation, setup and buyoff.
10. Ensure MC and employee always works in safety environment.
11. Dismantles, adjusts repairs and assembles equipment according to layout plans, blue prints, operating or repair manuals.
12. Requires only general instruction on new work.
13. Receives and follows detailed instructions on all work, closely supervised.

Job Requirements:

1. Two or more years of working experience in semiconductors field. It will be first priority if familiar with assemble FOL process (Die attach/Under fill/lid attach/plasma/Oven/SMT).
2. College diploma or university degree in Mechanics/Electronics or related.